高纯铜靶材胚料

纯度: 4N~7N

规格：常用直径：φ25.4mm,φ50mm,φ50.8mm,φ60mm,φ76.2mm,φ80mm,φ101.6mm,φ100mm;常用厚度：3mm~6.35mm;高纯铜靶材胚料的厚度，直径均可按客户要求定制。

主要用途：高纯铜靶材胚料是利用我们自主生产的铜板经熔铸轧制而成，主要用于光、电、半导体靶材等领域。应用于各种单靶溅射系统、多靶溅射系统、离子溅射系统等磁控溅射设备。

High purity copper target materials

Purity: 4N~7N

Specification: Common diameter: φ 25.4mm, φ 50mm, φ 50.8mm, φ 60mm, φ 76.2mm, φ 80mm, φ 101.6mm, φ 100mm; common thickness: 3mm ~ 6.35mm; the thickness and diameter of high-purity copper target embryo material can be customized according to customer requirements.

Main Usage：

High purity copper target blank is made of our own copper plate by melting, casting and rolling. It is mainly used in optical, electrical, semiconductor targets and other fields. It is used in various magnetron sputtering equipment, such as single target sputtering system, multi target sputtering system and ion sputtering system.